In order to test the function of the satellite navigation anti-interference special die, this paper describes the design of test board based on DOB process. The pads on bare die are connected to two different kinds of PCB pads, which one are kept in line and the other are kept staggered. There is an obvious difference about the bonding strength between them. Otherwise, there is no difference about the electrical characteristics between ASIC with package and die without package, so that the PCB design based on DOB process is effective in saving time and costs.